RF Solutions

Hybrid

EMC Shield Silver Copper Hybrid Colloid RF3001 has been formulated to meet the strictest
control of electrical interference both radiation and susceptibility. It is formulated with
specially prepared silver-coated copper particles and conductive resins to provide a
conductive layer when applied by RF Solutions, compatible on to plastic, resins and metal
substrates for a wide range of products. The highly conductive shield RF3001 when applied
to specification provides an effective shielding against radiated radio and Electromagnetic
interference (RFI & EMI) and in other application can act as a ground plane to protect against
electrostatic discharge (ESD) and can be a cost effective option over silver.

Key Points

• Compatible with sensitive plastics.
• Effective Shielding at 12.5Microns dry film thickness.
• Passes UL Environmental Requirements UL746C.
• Excellent Adhesion and Cohesion
• Can be applied to most substrates for flexible applications use RF2002
• Excellent Abrasion resistance scuff resistant.
• Highly conductive finish achieved within a few hours.
• Standard adhesion cross hatch test to ASTM D-3359-97 requirements.
• Typical resistance at 12.5 microns dry film >0.015ΩOhms / sq.
• RCA Abrader passes 500+ Cycles @ 25 microns dry film.
• COSHH, RoSH and REACH Compliant material
• Tested for long-term environmental stability to UL746C
• Temperature ageing 7 days exposure to 85 deg C @ 85% R.H.
• Temp Cycling – 10 cycles of, 75⁰C for 1hr, Ambient for 1hr & -30⁰C 1hr
• Humidity – 35⁰C for 56 days at 95% R.H.
• No degradation of properties after Environmental testing

• Data Sheet RF3001 CH-C